Normal Computing Corporation · Mountain View; New York
Founding mechanical engineer role defining the physical design of AI inference hardware based on the Thermo In-Memory Computing architecture, from accelerator through server to rack. Covers form factor, thermal solution and airflow, mechanical integration, serviceability, BOM and drawing releases, and shock, vibration, and thermal qualification. Tools named include SolidWorks, Creo, and NX, with FEA and tolerance analysis.
Normal is an applied AI company solving the hardest problems in AI and silicon. We build foundational hardware and software for the semiconductor industry, critical AI infrastructure, and the broader systems that power our world, in partnership with the world's most advanced institutions. We work as one team across New York City, Silicon Valley (Mountain View), and London.
Normal is building AI inference hardware based on our Thermo In-Memory Computing architecture, designed to deliver orders-of-magnitude more efficient compute. As the founding mechanical engineer on our hardware team, you will define the physical design of that hardware at every level of integration, from the accelerator through the server to the rack. You will help determine what fits, what can be cooled, what can be serviced, and where an existing supplier platform does the job.
You report to the head of our hardware systems organization and partner with our silicon, systems, and deployment engineers, and with the external design and manufacturing partners who build to our drawings.
We're looking for someone who thrives on turning a system architecture into hardware and takes pride in catching the problem before the build does.
The form factor, thermal envelope, mounting, and serviceability decisions you make set the foundation for the systems Normal ships, and the hardware you define is the hardware our customers run.
Candidates from OEM and ODM server teams, hyperscaler infrastructure teams, and earlier-stage hardware companies could all be well qualified for this role.
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